公开(公告)号：US09789691B2

公开(公告)日：2017-10-17

申请号：US14632801

申请日：2015-02-26

Applicant: SEIKO EPSON CORPORATION

Inventor： Hiroyuki Tsuchiya ,  Yasuhide Matsuo ,  Kenji Otsuka ,  Minehiro Imamura ,  Tomohiro Hayashi ,  Kei Tadachi

IPC: B41J2/15 ,  B41J2/16 ,  C09J183/04 ,  C08G77/00

CPC classification number: B41J2/1632 ,  B41J2/1612 ,  B41J2/1623 ,  B41J2/1626 ,  C08G77/80 ,  C09J183/04

Abstract: A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.

公开(公告)号：US10377135B2

公开(公告)日：2019-08-13

申请号：US15735884

申请日：2016-07-01

Applicant: Seiko Epson Corporation

Inventor： Yasuhide Matsuo ,  Kenji Otsuka ,  Hiroyuki Tsuchiya ,  Kei Tadachi ,  Wataru Takahashi

IPC: B41J2/14 ,  B41J2/16 ,  H01L41/047 ,  H01L41/187

Abstract: An electronic device includes a joined-structure assembly in which a plurality of structures are joined together. At least one of the plurality of structures includes a movable region, a part of an adhesive agent applied between the structures faces a space communicating with the movable region, and the adhesive agent includes an organo-siloxane compound with three or more reaction points.

公开(公告)号：US20190001681A1

公开(公告)日：2019-01-03

申请号：US15735884

申请日：2016-07-01

Applicant: Seiko Epson Corporation

Inventor： Yasuhide Matsuo ,  Kenji Otsuka ,  Hiroyuki Tsuchiya ,  Kei Tadachi ,  Wataru Takahashi

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/14209 ,  B41J2/14233 ,  B41J2/1607 ,  B41J2/161 ,  B41J2/1623 ,  B41J2002/14241 ,  B41J2002/14362 ,  H01L41/0472 ,  H01L41/1876

Abstract: An electronic device includes a joined-structure assembly in which a plurality of structures are joined together. At least one of the plurality of structures includes a movable region, a part of an adhesive agent applied between the structures faces a space communicating with the movable region, and the adhesive agent includes an organo-siloxane compound with three or more reaction points.

公开(公告)号：US10207484B2

公开(公告)日：2019-02-19

申请号：US15660643

申请日：2017-07-26

Applicant: SEIKO EPSON CORPORATION

Inventor： Hiroyuki Tsuchiya

IPC: B41J2/16 ,  B81C3/00 ,  C09J5/00 ,  B32B37/12

Abstract: A manufacturing method of a joined body in which a plurality of structures are joined to each other, the method including forming of an adhesive layer on one face of a medium; adjusting of viscosity of the adhesive layer formed in the forming of the adhesive layer; transcribing the adhesive layer of which viscosity is adjusted in the adjusting of viscosity to the structure; and measuring of surface roughness of the adhesive layer on a transcribing film in a stage before the transcribing.

公开(公告)号：US10525719B2

公开(公告)日：2020-01-07

申请号：US15922398

申请日：2018-03-15

Applicant: SEIKO EPSON CORPORATION

Inventor： Kei Tadachi ,  Satoshi Nagatoya ,  Hiroyuki Tsuchiya

IPC: B41J2/175 ,  F16J15/00 ,  B29C70/80 ,  B05D5/00

Abstract: A valve unit includes a flow path member having an opening surface that has a flow path opening of a liquid flow path, a valve having a sealing surface configured to seal the flow path opening, and a sealing member disposed on one of a peripheral portion of the flow path opening in the opening surface and a portion of the sealing surface facing the peripheral portion. The sealing surface is configured to be moved forward and backward relative to the opening surface to open and close the flow path opening. The sealing member is configured to be in contact with the peripheral portion of the flow path opening and the sealing surface when the valve is closed. The sealing member includes a fluorinated polyether.

公开(公告)号：US10189259B2

公开(公告)日：2019-01-29

申请号：US15671035

申请日：2017-08-07

Applicant: SEIKO EPSON CORPORATION

Inventor： Hiroyuki Tsuchiya ,  Yasuhide Matsuo ,  Kenji Otsuka ,  Minehiro Imamura ,  Tomohiro Hayashi ,  Kei Tadachi

IPC: B41J2/16 ,  C09J183/04 ,  C08G77/00

Abstract: A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.