公开(公告)号：US20180030296A1

公开(公告)日：2018-02-01

申请号：US15654064

申请日：2017-07-19

Applicant: SEIKO EPSON CORPORATION

Inventor： Tatsuya FUJII ,  Takuya SONOYAMA ,  Shotaro WATANABE

IPC: C09D11/36 ,  C09D11/106 ,  H01L51/00 ,  C09D11/033 ,  C09D11/328 ,  C09D11/54 ,  C09D11/52 ,  C09D11/102

Abstract: An ink composition includes a first component which is a hydrophilic solvent, a second component which is a hydrophobic solvent, a third component which is an amphiphilic solvent, and a fourth component which includes a solute or a dispersing element, and when the third component evaporates, the ink composition is separated into a phase which mainly includes the first component and a phase which mainly includes the second component.

公开(公告)号：US20190100040A1

公开(公告)日：2019-04-04

申请号：US16145979

申请日：2018-09-28

Applicant: SEIKO EPSON CORPORATION

Inventor： Tatsuya FUJII ,  Takumi SAGO ,  Tsukasa OTA ,  Satomi YOSHIOKA

IPC: B41J11/60

CPC classification number: B41J11/60 ,  B41J29/26 ,  G03G15/5062 ,  G03G15/6573 ,  G03G2215/00801

Abstract: A sheet processing device, a sheet manufacturing apparatus, and a sheet processing method enable effectively removing the color material of printed parts. A sheet processing device for processing a printed sheets has a detector configured to detect the printed parts of the sheet; and a refining prevention agent applicator configured to selectively apply a refining prevention agent that prevents refinement of the sheet to a printed area including the printed parts detected by the detector.

公开(公告)号：US20230240016A1

公开(公告)日：2023-07-27

申请号：US18157172

申请日：2023-01-20

Applicant: SEIKO EPSON CORPORATION

Inventor： Toshimitsu HIRAI ,  Hironori HASEI ,  Tatsuya FUJII

IPC: H05K3/12 ,  H05K1/09 ,  H05K1/03

CPC classification number: H05K3/125 ,  H05K1/097 ,  H05K1/0306 ,  H05K3/38

Abstract: A method of forming a conductive pattern includes forming a conductive pattern by ejecting a liquid-state material containing conductive fine particles onto a porous base material, wherein the conductive fine particles have an average particle size of from 1 nm to 200 nm, and the porous base material is formed with a plurality of cavities and includes communication holes through which the plurality of cavities are in communication, an average diameter of the communication holes being less than or equal to the average particle size of the conductive fine particles.