公开(公告)号：US20230167214A1

公开(公告)日：2023-06-01

申请号：US17784217

申请日：2020-12-10

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Kenji YAMAUCHI ,  Takeshi WAKIYA ,  Tatsuya MATSUKUBO ,  Kanako TAMAGAWA ,  Jo OTSUKA ,  Yumi KANEKO

IPC: C08F220/18 ,  C08F2/38

CPC classification number: C08F220/1804 ,  C08F2/38

Abstract: The present invention provides a resin composition for sintering, an inorganic fine particle-dispersed slurry composition containing the resin composition for sintering, and an inorganic fine particle-dispersed sheet formed using the resin composition for sintering or inorganic fine particle-dispersed slurry composition. The present invention relates to a resin composition for sintering, containing a binder resin, the binder resin including a (meth)acrylic resin (A), the (meth)acrylic resin (A) having at least one selected from the group consisting of a sulfone group, an alkyl sulfonyl group, an aromatic sulfonyl group, a sulfine group, an imidazoline group, a carboxy group, an amide group, an amino group, and a hydroxy group at at least one molecular end of the main chain and having a weight average molecular weight (Mw) of 1,000,000 or more, an amount of a water-soluble surfactant in the resin composition for sintering being 0 parts by weight or more and 0.02 parts by weight or less per 100 parts by weight of the binder resin.