SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD USING THE SAME

    公开(公告)号:US20230114015A1

    公开(公告)日:2023-04-13

    申请号:US17942136

    申请日:2022-09-10

    Abstract: The present disclosure provides a substrate treating apparatus capable of stably moving a substrate and discharging an ink at an accurate position. The substrate treating apparatus of the present disclosure comprises: a stage extending in a first direction and moving a substrate along the first direction; moving units disposed on both sides of the stage extending in the first direction, respectively, and configured to move the substrate in the first direction; and a control unit configured to align the substrate, wherein the moving unit includes a first gripper and a second gripper configured to adsorb one side and the other side of the substrate, respectively, after the first gripper adsorbs one side of the substrate, the control unit aligns the substrate, and after the substrate is aligned, the second gripper adsorbs the other side of the substrate and the substrate is moved in the first direction.

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