MICROWAVE HEAT TREATMENT APPARATUS AND IMPEDANCE MATCHING METHOD

    公开(公告)号:US20250167751A1

    公开(公告)日:2025-05-22

    申请号:US18951966

    申请日:2024-11-19

    Abstract: Disclosed are a microwave heat treatment apparatus and an impedance matching method between a microwave power supply and a chamber in the microwave heat treatment apparatus. The impedance matching method includes the steps of initially adjusting the impedance of a tuner circuit between the microwave power supply and the chamber based on pre-matching data for a heat treatment process, applying microwave power to the chamber from the microwave power supply through the tuner circuit having the initially adjusted impedance, measuring process data related to the impedance of the chamber to which the microwave power has been applied, determining an impedance tuning value of the tuner circuit by comparing the process data and the pre-matching data, and adjusting the impedance of the tuner circuit based on the impedance tuning value.

    GAS SUPPLYING APPARATUS, GAS SUPPLY CONTROL METHOD, AND SUBSTRATE PROCESSING APPARATUS

    公开(公告)号:US20240371660A1

    公开(公告)日:2024-11-07

    申请号:US18651874

    申请日:2024-05-01

    Abstract: Proposed are a gas supplying apparatus, a gas supply control method, and a substrate processing apparatus. The device that supplies a gas to a chamber adapted to perform a processing operation on a substrate includes a gas supply line connected from a gas source to the chamber and providing a flow path for the gas, a circulation line branching off from a branch point of the gas supply line and connected to an upstream side of the branch point, an ejector having an internal space that sucks a gas provided from the circulation line using a pressure of the gas introduced from the gas source, and injecting the gas in the internal space into the gas supply line, and a flow control module configured to regulate a flow rate of the gas supplied to the chamber by controlling the pressure of the gas in the gas supply line.

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