公开(公告)号：US20210358720A1

公开(公告)日：2021-11-18

申请号：US17315322

申请日：2021-05-09

Applicant: SEMES CO., LTD.

Inventor： HANGLIM LEE ,  MINYOUNG KIM ,  JIHOON PARK

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/687 ,  B08B7/00 ,  G03F7/42

Abstract: An embodiment of the inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a lower electrode having an upper surface, on which a substrate is positioned, and a plasma generating device provided at an upper portion of the lower electrode, having an upper electrode, and having independent discharge spaces divided by a plurality of partition walls, and a controller that performs a control to independently supply a reaction gas into the independent discharge spaces, respectively.

公开(公告)号：US20210375596A1

公开(公告)日：2021-12-02

申请号：US17335239

申请日：2021-06-01

Applicant: SEMES CO., LTD.

Inventor： HANGLIM LEE ,  MINYOUNG KIM ,  JIHOON PARK

IPC: H01J37/32

Abstract: Disclosed is a substrate treating apparatus that includes an index module including a plurality of load ports on each of which a carrier having a substrate received therein is placed and a transfer frame in which an index robot that transfers the substrate is installed, a process module that is connected with the index module and that includes process chambers in each of which the substrate is treated, and a substrate treating unit that is provided in the index module and that treats the substrate, the substrate treating unit being provided along a direction in which the plurality of load ports are arranged.