公开(公告)号：US20210005419A1

公开(公告)日：2021-01-07

申请号：US16918299

申请日：2020-07-01

Applicant: SEMES CO., LTD.

Inventor： Hyoungkyu SON ,  Yu Dong HAN ,  Hyeon Gyu KIM ,  Seon Ok KIM

IPC: H01J37/20 ,  H01J37/32 ,  H01L21/683

Abstract: A support unit provided in an apparatus for treating a substrate using plasma includes a dielectric plate on which the substrate is placed, an electrode plate disposed under the dielectric plate, a power supply rod that applies power to the electrode plate, and a flange that has a shape surrounding the power supply rod and that is spaced apart from the power supply rod.