公开(公告)号：US20240177976A1

公开(公告)日：2024-05-30

申请号：US18514080

申请日：2023-11-20

Applicant: SEMES CO., LTD.

Inventor： Hyoungkyu SON ,  Juyong JANG

IPC: H01J37/32

CPC classification number: H01J37/32522 ,  H01J37/32715 ,  H01J2237/2001 ,  H01J2237/2007

Abstract: Provided is a liner structure including a liner body, a heating coil arranged in the liner body and configured to heat the liner body, and a magnetic coil arranged below the heating coil in the liner body and configured to generate a magnetic field.

公开(公告)号：US20230369029A1

公开(公告)日：2023-11-16

申请号：US18298551

申请日：2023-04-11

Applicant: SEMES CO., LTD.

Inventor： Hyoungkyu SON ,  Jaewoong Sim ,  Donguk Kim ,  Yunsang Kim ,  Inhoe Kim

IPC: H01J37/32

CPC classification number: H01J37/32642 ,  H01J37/32697 ,  H01J37/32724 ,  H01J37/32082 ,  H01J2237/002 ,  H01J2237/2007

Abstract: A substrate processing device is provided. The substrate processing device includes: a substrate supporter configured to support a substrate; a heating ring horizontally surrounding the substrate supporter; and an edge ring horizontally surrounding the heating ring and configured to cover a top surface of the heating ring.

公开(公告)号：US20210005419A1

公开(公告)日：2021-01-07

申请号：US16918299

申请日：2020-07-01

Applicant: SEMES CO., LTD.

Inventor： Hyoungkyu SON ,  Yu Dong HAN ,  Hyeon Gyu KIM ,  Seon Ok KIM

IPC: H01J37/20 ,  H01J37/32 ,  H01L21/683

Abstract: A support unit provided in an apparatus for treating a substrate using plasma includes a dielectric plate on which the substrate is placed, an electrode plate disposed under the dielectric plate, a power supply rod that applies power to the electrode plate, and a flange that has a shape surrounding the power supply rod and that is spaced apart from the power supply rod.