公开(公告)号：US20170318627A1

公开(公告)日：2017-11-02

申请号：US15463319

申请日：2017-03-20

Applicant: SEMES CO., LTD.

Inventor： Jung Min WON ,  Ik-Jin CHOI ,  Hyo Seong SEONG ,  Shin-Woo NAM

IPC: H05B3/62 ,  F27D7/06

CPC classification number: F27D7/06 ,  H05B3/283

Abstract: An embodiment includes an apparatus for controlling temperature of a substrate, an apparatus for treating a substrate comprising the same, and a method of controlling the same, which may control the temperature of the substrate by each area and not increasing the volume of the apparatus. The substrate temperature control apparatus comprises: a support plate for supporting a substrate; a plurality of heating units placed in different area of the substrate and controlling a temperature of the substrate by each area; a power supply unit for providing a power to control the temperature of the substrate; a switch unit connected between the plurality of heating units and the power supply unit, and obtaining one or more of a transistor device; and a controller for controlling a power which is supplied to each heating units by controlling unit.