公开(公告)号：US20170316920A1

公开(公告)日：2017-11-02

申请号：US15443212

申请日：2017-02-27

Applicant: SEMES CO., LTD.

Inventor： Harutyun MELIKYAN ,  Junghwan LEE ,  Jong Hwan AN ,  Shin-Woo NAM

IPC: H01J37/32 ,  H01L21/67

CPC classification number: H01J37/3211 ,  H01J37/3244 ,  H01J2237/334 ,  H01L21/67069

Abstract: An antenna and a substrate treating process utilizing the same are provided. The antenna may extend along an imaginary baseline having predetermined curvature and comprise a section where the distance between the baseline and intersection point between the antenna and a vertical line perpendicular to the baseline changes depending on a position on the baseline.

公开(公告)号：US20170103871A1

公开(公告)日：2017-04-13

申请号：US15291193

申请日：2016-10-12

Applicant: SEMES CO., LTD.

Inventor： Jong Hwan AN ,  Shin-Woo NAM ,  Hong Won LEE ,  Jae Bak SHIM

IPC: H01J37/32 ,  G01R29/02 ,  H03H7/24 ,  G01R23/10 ,  H02M7/04 ,  H03H7/38

CPC classification number: H01J37/32146 ,  G01R21/12 ,  G01R23/04 ,  G01R23/10 ,  G01R29/02 ,  H01J37/32174 ,  H01J37/32935 ,  H01J2237/334 ,  H02M7/04 ,  H03H7/24 ,  H03H7/38

Abstract: Disclosed are an apparatus for monitoring pulsed high-frequency power and a substrate processing apparatus including the same. The apparatus includes an attenuation module configured to attenuate a pulsed high-frequency power signal; a rectifier module configured to convert the pulsed high-frequency power signal into a direct current signal; and a detection module configured to detect a pulse parameter based on the direct current signal.

公开(公告)号：US20170318627A1

公开(公告)日：2017-11-02

申请号：US15463319

申请日：2017-03-20

Applicant: SEMES CO., LTD.

Inventor： Jung Min WON ,  Ik-Jin CHOI ,  Hyo Seong SEONG ,  Shin-Woo NAM

IPC: H05B3/62 ,  F27D7/06

CPC classification number: F27D7/06 ,  H05B3/283

Abstract: An embodiment includes an apparatus for controlling temperature of a substrate, an apparatus for treating a substrate comprising the same, and a method of controlling the same, which may control the temperature of the substrate by each area and not increasing the volume of the apparatus. The substrate temperature control apparatus comprises: a support plate for supporting a substrate; a plurality of heating units placed in different area of the substrate and controlling a temperature of the substrate by each area; a power supply unit for providing a power to control the temperature of the substrate; a switch unit connected between the plurality of heating units and the power supply unit, and obtaining one or more of a transistor device; and a controller for controlling a power which is supplied to each heating units by controlling unit.

公开(公告)号：US20210050184A1

公开(公告)日：2021-02-18

申请号：US17089041

申请日：2020-11-04

Applicant: SEMES CO., LTD.

Inventor： Jong Hwan AN ,  Shin-Woo NAM ,  Hong Won LEE ,  Jae Bak SHIM

IPC: H01J37/32 ,  G01R23/04 ,  G01R23/10 ,  G01R29/02 ,  H02M7/04 ,  H03H7/24 ,  H03H7/38

Abstract: Disclosed are an apparatus for monitoring pulsed high-frequency power and a substrate processing apparatus including the same. The apparatus includes an attenuation module configured to attenuate a pulsed high-frequency power signal; a rectifier module configured to convert the pulsed high-frequency power signal into a direct current signal; and a detection module configured to detect a pulse parameter based on the direct current signal.

公开(公告)号：US20180315580A1

公开(公告)日：2018-11-01

申请号：US15962487

申请日：2018-04-25

Applicant: SEMES CO., LTD.

Inventor： Harutyun MELIKYAN ,  Ogsen GALSTYAN ,  Junghwan LEE ,  Jong Hwan AN ,  Shin-Woo NAM

IPC: H01J37/32 ,  H03H7/40

CPC classification number: H01J37/32174 ,  H01J37/321 ,  H03H7/40

Abstract: Disclosed inventions are apparatus for supplying power and an apparatus for treating a substrate including the same. The apparatus for supplying power includes a high-frequency power source that provides a high-frequency power; a plasma source including first and second antennas that generates plasma by using the high-frequency power; and a power divider connected between the high-frequency power source and the plasma source to divide the high-frequency power supplied to the first and second antennas. The power divider includes a first variable device that controls the high-frequency power supplied to the first and second antennas; and a second variable device that compensates for non-linearity of the high-frequency power supplied to the first and second antennas.

公开(公告)号：US20180102238A1

公开(公告)日：2018-04-12

申请号：US15702119

申请日：2017-09-12

Applicant: SEMES CO., LTD.

Inventor： Jamyung GU ,  Jong Hwan AN ,  Shin-Woo NAM ,  Sooryun RO

IPC: H01J37/32 ,  H02N13/00 ,  H03H7/38 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01J37/32642 ,  H01J37/32174 ,  H01J37/32183 ,  H01J37/32449 ,  H01J37/32477 ,  H01J37/32522 ,  H01J37/32715 ,  H01J2237/0203 ,  H01J2237/334 ,  H01L21/67069 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/6831 ,  H02N13/00 ,  H03H7/38

Abstract: A substrate treating apparatus includes a chamber having a treatment space in the interior thereof, a support unit that supports a substrate in the treatment space, a gas supply unit configured to supply a treatment gas into the treatment space, and a plasma source configured to generate plasma from the treatment gas. The support unit includes an electrostatic chuck, on which the substrate is positioned, a first ring surrounding a circumference of the substrate positioned on the electrostatic chuck, a second ring surrounding a circumference of the electrostatic chuck and formed of an insulation material, an insertion body disposed in the second ring and formed of a conductive material, and an impedance control unit configured to adjust an impedance of the insertion body.