公开(公告)号：US20240427250A1

公开(公告)日：2024-12-26

申请号：US18750169

申请日：2024-06-21

Applicant: SEMES CO., LTD.

Inventor： Jae Ho LEE ,  Jong Gu LEE ,  Dae Sung KIM ,  Jae Hyun LIM ,  Nak Hyun SONG

IPC: G03F7/16 ,  G03F7/00

Abstract: Disclosed is an apparatus for treating a substrate, the apparatus including: a housing having an inner space; a plurality of outer cups arranged in a row in the inner space, each having a processing space; a spin chuck for supporting and rotating a substrate in each of the processing spaces; and a treatment solution nozzle provided in a plurality to correspond to the plurality of outer cups, respectively, and for supplying a treatment solution onto the substrate supported by the spin chuck, in which the outer cup includes a sidewall surrounding the spin chuck, the sidewall includes a first region and a second region located adjacent to each other along a circumferential direction thereof, and the outer cup includes a first protrusion installed in the first region while extending upwardly on a top end of the sidewall.