SUBSTRATE PROCESSING APPARATUS
    1.
    发明公开

    公开(公告)号:US20230311153A1

    公开(公告)日:2023-10-05

    申请号:US18101121

    申请日:2023-01-25

    CPC classification number: B05C5/001 B05C11/08 B05D1/005

    Abstract: A substrate processing apparatus, which may suppress occurrence of temperature deviation caused by an air current, is provided. The substrate processing apparatus includes a chamber including an upper body and a lower body and having a processing space formed therein by the upper body and the lower body, a substrate support unit disposed in the processing space and having a support surface on which the substrate is supported, a heater disposed to heat gas in the processing space, an introduction unit configured to supply gas toward an edge of the support surface, and a discharge unit configured to discharge the gas in the processing space. The discharge unit may include a plurality of outlets spaced apart from a centerline of the support surface in the upper body and disposed to be closer to the centerline of the support surface than to the introduction unit.

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