SUBSTRATE PROCESSING APPARATUS
    1.
    发明申请

    公开(公告)号:US20250069908A1

    公开(公告)日:2025-02-27

    申请号:US18779123

    申请日:2024-07-22

    Abstract: A substrate processing apparatus includes a support unit configured to support a substrate and be rotatable, a chemical liquid supply nozzle configured to supply a chemical liquid to a chemical liquid supply area of the substrate, and a charging unit disposed adjacent to the substrate. The charging unit is disposed adjacent to the chemical liquid supply nozzle, and is charged with charges opposite to charges of the chemical liquid.

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