公开(公告)号：US20210013008A1

公开(公告)日：2021-01-14

申请号：US16918219

申请日：2020-07-01

申请人： SEMES CO., LTD.

发明人： Jun Pyo Hong ,  Seungbae Lee ,  Ki Yung Lee

IPC分类号： H01J37/32 ,  H01L21/02 ,  H01L21/683 ,  H01J37/34

摘要： Provided is an apparatus for treating a substrate. The substrate treating apparatus includes a substrate supporting unit for supporting the substrate and fixing the substrate with electrostatic force, a plasma generating unit for generating a discharging plasma for discharging a charge of the substrate, and a power supplying unit for supplying power to the substrate supporting unit and the plasma generating unit, wherein the power supplying unit supplies power of a fluctuating pattern to the plasma generating unit when a charge of the substrate is discharged.

公开(公告)号：US11881382B2

公开(公告)日：2024-01-23

申请号：US16918219

申请日：2020-07-01

申请人： SEMES CO., LTD.

发明人： Jun Pyo Hong ,  Seungbae Lee ,  Ki Yung Lee

IPC分类号： H01J37/32 ,  H01J37/34 ,  H01L21/683 ,  H01L21/02

CPC分类号： H01J37/32174 ,  H01J37/3444 ,  H01L21/02315 ,  H01L21/6831

摘要： Provided is an apparatus for treating a substrate. The substrate treating apparatus includes a substrate supporting unit for supporting the substrate and fixing the substrate with electrostatic force, a plasma generating unit for generating a discharging plasma for discharging a charge of the substrate, and a power supplying unit for supplying power to the substrate supporting unit and the plasma generating unit, wherein the power supplying unit supplies power of a fluctuating pattern to the plasma generating unit when a charge of the substrate is discharged.