SUBSTRATE PROCESSING APPARATUS
    1.
    发明公开

    公开(公告)号:US20240207903A1

    公开(公告)日:2024-06-27

    申请号:US18393884

    申请日:2023-12-22

    CPC classification number: B08B3/04 H01L21/67017

    Abstract: Provided is a substrate processing apparatus including a body having a substrate treatment space therein, a fluid supply unit configured to supply a treatment fluid to the substrate treatment space, a fluid exhaust line to exhaust the treatment fluid from the substrate treatment space, a clamp body configured to surround and fix the body, a friction prevention member arranged between the body and the clamp body and configured to prevent friction between the body and the clamp body, a conductor extending along at least a portion of an outer rim of the friction prevention member, and a processor configured to detect whether the conductor has been deformed, based on an output signal that is output in response to an electrical signal applied to the conductor.

Patent Agency Ranking