公开(公告)号：US20220208580A1

公开(公告)日：2022-06-30

申请号：US17534716

申请日：2021-11-24

Applicant: SEMES CO., LTD.

Inventor： Myoung Hoon WOO

IPC: H01L21/67 ,  G06T7/90 ,  G06T7/70 ,  G06T7/11 ,  G06T7/00

Abstract: A wafer inspection method includes acquiring an inspection image from an edge region of a wafer, generating a color profile of the inspection image in a radial direction of the wafer, detecting a side surface of a layer formed on the wafer based on a change in the color profile in a first direction from a side surface of the wafer toward a center of the wafer, and calculating a distance between the side surface of the layer and the side surface of the wafer.

公开(公告)号：US20220065799A1

公开(公告)日：2022-03-03

申请号：US17406784

申请日：2021-08-19

Applicant: SEMES CO., LTD.

Inventor： Myoung Hoon WOO

IPC: G01N21/956 ,  G06T7/00 ,  G01N21/88 ,  G01N21/95 ,  G06T7/11

Abstract: An image acquiring method, an image acquiring apparatus and a wafer inspection apparatus are disclosed. A line scan camera is disposed above a transfer path of a wafer to continuously acquire partial images having a predetermined size by imaging a scan area including a portion of the transfer path, and the partial images are stored in an image storage unit. A partial image including a predetermined feature point among the partial images is detected by an image analysis unit, and an image merging unit merges a predetermined number of partial images including the detected partial image to acquire an entire image of the wafer. An image inspection unit analyzes the entire image of the wafer to detect defects in the wafer.