公开(公告)号：US20190157130A1

公开(公告)日：2019-05-23

申请号：US16194014

申请日：2018-11-16

Applicant: SEMES CO., LTD.

Inventor： SEUNG PYO LEE ,  HYUNG JOON KIM

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/683 ,  H01J37/32

Abstract: Disclosed are a support unit and a substrate treating apparatus comprising the same. The inventive concept provides a support unit that may prove temperature uniformity between facing areas on a substrate the other areas of the substrate and may solve a problem of not easily separating a substrate by a negative pressure in a pin hole when the substrate is separated from the support unit, and a substrate treating apparatus.