公开(公告)号：US10153137B2

公开(公告)日：2018-12-11

申请号：US15293393

申请日：2016-10-14

Applicant: SEMES CO., LTD.

Inventor： Seok Won Hwang ,  Kisang Eum ,  Sun Wook Jung

IPC: H01J37/32

Abstract: The inventive concepts provide a substrate treating apparatus. The substrate treating apparatus includes a process chamber in which a treatment space is provided, a support unit supporting a substrate in the process chamber, a gas supply unit supplying a gas into the process chamber, and a plasma source generating plasma from the gas. The support unit includes a support plate on which a substrate is loaded, a focus ring disposed to surround the support plate, an electric field adjusting ring disposed under the focus ring, and an actuator vertically moving the electric field adjusting ring.