SUBSTRATE SUPPORT APPARATUS, SUBSTRATE TREATING SYSTEM INCLUDING THE SAME, AND SUBSTRATE TREATING METHOD

    公开(公告)号:US20180122660A1

    公开(公告)日:2018-05-03

    申请号:US15796318

    申请日:2017-10-27

    Abstract: Embodiments of the inventive concept relate to an apparatus for supporting a substrate and a method for treating a substrate. The substrate support apparatus includes a substrate support member including a support plate having an upper surface that supports a substrate, and a heating member provided in the support plate to heat the substrate, wherein an area of the support plate has a buffer area, in which a buffer space for restricting a heat transfer rate of heat provided from the heating member to the upper surface is formed. The buffer space insulates a central area and a peripheral area, thereby maximizing a temperature difference between the central area and the peripheral area.

    SUBSTRATE TREATING UNIT, BAKING APPARATUS INCLUDING THE SAME, AND SUBSTRATE TREATING METHOD USING BAKING APPARATUS

    公开(公告)号:US20170372926A1

    公开(公告)日:2017-12-28

    申请号:US15627878

    申请日:2017-06-20

    CPC classification number: H01L21/67103 H01L21/67109

    Abstract: Disclosed is a heating unit that heats a substrate. The heating unit includes a housing providing a treatment space in the interior thereof, a heating plate supporting a substrate in the treatment space, a heating member provided in the heating plate and configured to heat-treat the substrate supported by the heating plate, an exhaust member configured to exhaust gas in an interior space of the housing, and an exterior gas supply part installed in the housing and configured to supply exterior gas into the treatment space, wherein the exterior gas supply part includes a plurality of inlets provided in the housing, and a plurality of flow rate adjusting members installed in the inlets, respectively, and configured to adjust flow rates of the exterior gas introduced into the inlets.

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