公开(公告)号：US10705137B2

公开(公告)日：2020-07-07

申请号：US15896399

申请日：2018-02-14

Applicant: SEMES CO., LTD.

Inventor： Soo Man Kwak ,  Hyun Chai Jung ,  Jin Gook Kim

IPC: G01R31/28 ,  H01L21/66 ,  G01R31/382

Abstract: A method of testing semiconductor packages, which performs an electrical test on the semiconductor packages after receiving the semiconductor packages into insert pockets of a test tray and connecting with sockets of a tester by using pusher units each including a heater, includes receiving temperature information of the semiconductor packages from the tester while testing the semiconductor packages, calculating an overall average temperature of the semiconductor packages from the received temperature information, and individually controlling operations of heaters of the pusher units based on difference values between the overall average temperature and individual temperatures of the semiconductor packages.