公开(公告)号：US20250157795A1

公开(公告)日：2025-05-15

申请号：US18939613

申请日：2024-11-07

Applicant: SEMES CO., LTD.

Inventor： Jun Seok PARK ,  Jong Joon JEON ,  Yong Jae KIM ,  Chul Ho JUNG ,  Ja Myung GU

IPC: H01J37/32 ,  H01J9/30

Abstract: Disclosed are an electrostatic chuck capable of preventing deformation of a bonding layer and damage to a lift pin, a method of manufacturing the electrostatic chuck, and a plasma processing apparatus. The electrostatic chuck configured to support a substrate and to receive a lift pin so that the lift pin is ascendable and descendable therein includes at least one pin hole formed vertically therethrough to allow the lift pin to ascend and descend along the pin hole, a ceramic puck configured to allow the substrate to be seated thereon, a base plate configured to support the ceramic puck, a bonding layer configured to bond the ceramic puck to the base plate, and an insulating pipe mounted on an inner side wall of the pin hole. The insulating pipe includes an upper insulating pipe bonded to the ceramic puck and a lower insulating pipe adhered to the base plate.