公开(公告)号：US10460923B2

公开(公告)日：2019-10-29

申请号：US15635535

申请日：2017-06-28

Applicant: SEMES CO., LTD.

Inventor： Young Ha Kim ,  Se Jeong Choi ,  Kang Suk Lee ,  Kiyoung Kwark ,  Jeoung Eun Park ,  Jeong Yeong Park

IPC: H01L21/02 ,  B08B3/02 ,  B08B3/08 ,  B08B3/10 ,  H01L21/67 ,  H01L21/687

Abstract: Disclosed are an apparatus and a method for liquid-treating a substrate. The method for liquid-treating a substrate includes a first treatment liquid supplying operation of supplying a first treatment liquid to a treatment location of the substrate, and a wetting operation of, after the first treatment liquid supplying operation, supplying a wetting liquid onto the substrate, wherein the wetting operation includes a simultaneous supply operation of supplying the wetting liquid to the first location while the first treatment liquid is supplied, and wherein the first location is a location deviating from the treatment location. Accordingly, the surface of the substrate may be prevented from being dried while the treatment liquid is converted to a wetting liquid.