公开(公告)号：US20250157893A1

公开(公告)日：2025-05-15

申请号：US18507381

申请日：2023-11-13

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jie CHANG ,  Sen SUN ,  XiaoYing YUAN ,  Sixin JI ,  AnAn XING ,  Keunhyuk LEE

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

Abstract: A package includes a semiconductor die attached to a die attach pad by a first sinter bond. The package further includes a clip having a first end and a second end. The first end of the clip is attached to a device contact pad on the semiconductor die by a second sinter bond and the second end of the clip is attached to a post of a lead by a joint. The package further includes a mold body encapsulating the semiconductor die.