公开(公告)号：US20250157893A1

公开(公告)日：2025-05-15

申请号：US18507381

申请日：2023-11-13

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jie CHANG ,  Sen SUN ,  XiaoYing YUAN ,  Sixin JI ,  AnAn XING ,  Keunhyuk LEE

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

Abstract: A package includes a semiconductor die attached to a die attach pad by a first sinter bond. The package further includes a clip having a first end and a second end. The first end of the clip is attached to a device contact pad on the semiconductor die by a second sinter bond and the second end of the clip is attached to a post of a lead by a joint. The package further includes a mold body encapsulating the semiconductor die.

公开(公告)号：US20240021487A1

公开(公告)日：2024-01-18

申请号：US18349440

申请日：2023-07-10

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jie CHANG ,  XiaoYing YUAN ,  Keunhyuk LEE ,  Paolo BILARDO

IPC: H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L23/367 ,  H01L21/56

CPC classification number: H01L23/3107 ,  H01L23/4951 ,  H01L23/49844 ,  H01L23/3675 ,  H01L21/565

Abstract: A package includes a semiconductor die attached to a substrate and a molded body encapsulating the semiconductor die. The molded body is a six-sided rectangular box-like structure and at least a corner portion of the molded body formed by two adjacent sides is devoid of molding material reducing a size and a weight of the molded body.

公开(公告)号：US20240312855A1

公开(公告)日：2024-09-19

申请号：US18185514

申请日：2023-03-17

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： XiaoYing YUAN ,  Jie CHANG ,  Keunhyuk LEE

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/495

CPC classification number: H01L23/3107 ,  H01L21/565 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49551 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/13091

Abstract: A package includes a semiconductor die attached to a substrate and a mold body encapsulating the semiconductor die. A first portion of a lead is directly bonded to a contact pad on the semiconductor die with no intervening component between the first portion of the lead and the contact pad. A second portion of the lead extends outside the mold body to form an external terminal of the package. The lead is a dual gauge lead with the first portion of the lead having a thickness perpendicular to the contact pad that is smaller than a thickness of the second portion of the lead extending outside the mold body.

公开(公告)号：US20240304529A1

公开(公告)日：2024-09-12

申请号：US18181950

申请日：2023-03-10

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jie CHANG ,  XiaoYing YUAN ,  Keunhyuk LEE ,  Jerome TEYSSEYRE ,  Leo GU

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/31 ,  H01L25/00 ,  H01L25/07

CPC classification number: H01L23/49575 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49503 ,  H01L25/072 ,  H01L25/50 ,  H01L23/49562

Abstract: Implementations of high-power semiconductor device modules are described, including automotive power transistor assemblies for use in power amplifier circuits such as a cascode circuit. In some implementations, power amplifier circuit components are provided on separate semiconductor die attached to discrete dual die attach pads. A separation between the die attach pads, as well as a through-hole, provide sufficient isolation between the die to permit operation of the circuit at high voltages without relying on a thick multi-layer direct bond copper (DBC) isolation structure. In some implementations, higher voltage operation can be supported by a thin multi-layer, resin coated copper DAP in which the top layer is split.