公开(公告)号：US20210066256A1

公开(公告)日：2021-03-04

申请号：US16671450

申请日：2019-11-01

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Seungwon IM ,  ByoungOk LEE ,  Oseob JEON

IPC: H01L25/07 ,  H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56

Abstract: In a general aspect, a semiconductor device can include a substrate and a positive power supply terminal electrically coupled with the substrate, the positive power supply terminal being arranged in a first plane. The device can also include a first negative power supply terminal, laterally disposed from the positive power supply terminal and arranged in the first plane. The device can further include a second negative power supply terminal, laterally disposed from the positive power supply terminal and arranged in the first plane. The positive power supply terminal can be disposed between the first and second negative power supply terminals. The device can also include a conductive clip electrically coupling the first negative power supply terminal with the second negative power supply terminal via a conductive bridge. A portion of the conductive bridge can be arranged in a second plane that is parallel to, and non-coplanar with the first plane.

公开(公告)号：US20220157688A1

公开(公告)日：2022-05-19

申请号：US16949894

申请日：2020-11-19

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： JooYang EOM ,  Inpil YOO ,  Seungwon IM ,  ByoungOk LEE

IPC: H01L23/367 ,  H01L21/48

Abstract: In a general aspect, an apparatus can include a metal layer disposed on a surface of the substrate. The apparatus can also include a recess formed in the metal layer and a cooling fin coupled with the metal layer. A portion of the cooling fin can be disposed within the recess.

公开(公告)号：US20180254262A1

公开(公告)日：2018-09-06

申请号：US15449473

申请日：2017-03-03

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Seungwon IM ,  Mankyo JONG ,  ByoungOk LEE ,  Joonseo SON ,  Oseob JEON

IPC: H01L25/065 ,  H01L23/31 ,  H01L29/739

CPC classification number: H02M7/003 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/49537 ,  H01L23/498 ,  H01L24/33 ,  H01L25/072

Abstract: In a general aspect, an apparatus can include a first substrate operatively coupled with a second substrate. The apparatus can also include a power supply terminal assembly including a first power supply terminal aligned along a first plane, the first power supply terminal being electrically coupled with the first substrate. The power supply terminal assembly can also include a second power supply terminal aligned along a second plane, the second power supply terminal being electrically coupled with the second substrate. The power supply terminal assembly can further include a power supply terminal frame having an isolation portion disposed between the first power supply terminal and the second power supply terminal and a retention portion disposed around a portion of the first power supply terminal and disposed around a portion of the second power supply terminal.