公开(公告)号：US20190067171A1

公开(公告)日：2019-02-28

申请号：US16102922

申请日：2018-08-14

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Maria Cristina ESTACIO ,  Marlon BARTOLO ,  Maria Clemens Ypil QUINONES ,  Chung-Lin WU

IPC: H01L23/495 ,  H01L23/00

Abstract: In a general aspect, an electronic device assembly can include a dielectric substrate having a first surface and a second surface opposite the first surface and a leadframe including: a first leadframe portion including a first plurality of signal leads; and a second leadframe portion including a second plurality of signal leads. The substrate can be coupled with a subset of the first plurality of signal leads and a subset of the second plurality of signal leads. Signal leads of the first plurality of signal leads, other than the subset of the first plurality of signal leads, can be spaced from the dielectric substrate. Signal leads of the second plurality of signal leads, other than the subset of the second plurality of signal leads, can be spaced from the dielectric substrate. The assembly can further include first and second semiconductor die that are electrically coupled with the substrate and the leadframe portions.