公开(公告)号：US20210320054A1

公开(公告)日：2021-10-14

申请号：US16846778

申请日：2020-04-13

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Hiroshi INOGUCHI ,  Takashi NAGASHIMA ,  Roger Paul STOUT ,  Namrata KANTH

IPC: H01L23/495 ,  H01L23/367 ,  H01L23/498 ,  H01L23/373 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor device package includes a leadframe, and a heatsink bonded to the leadframe. A semiconductor device may be mounted using the leadframe and positioned such that heat generated by the semiconductor device is conducted by the heatsink, with molding that encapsulates the leadframe, the heatsink, and the semiconductor device.