公开(公告)号：US20210320054A1

公开(公告)日：2021-10-14

申请号：US16846778

申请日：2020-04-13

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Hiroshi INOGUCHI ,  Takashi NAGASHIMA ,  Roger Paul STOUT ,  Namrata KANTH

IPC: H01L23/495 ,  H01L23/367 ,  H01L23/498 ,  H01L23/373 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor device package includes a leadframe, and a heatsink bonded to the leadframe. A semiconductor device may be mounted using the leadframe and positioned such that heat generated by the semiconductor device is conducted by the heatsink, with molding that encapsulates the leadframe, the heatsink, and the semiconductor device.

公开(公告)号：US20220137102A1

公开(公告)日：2022-05-05

申请号：US17089842

申请日：2020-11-05

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Hiroshi INOGUCHI ,  Takashi NAGASHIMA ,  Masaru MAEDA

IPC: G01R19/00 ,  H01L23/495 ,  H01L25/16 ,  H01L23/00 ,  H01L21/66

Abstract: Implementations of a semiconductor package system may include a first bond wire bonded to a portion of a leadframe and to a pad of a semiconductor die, the first bond wire coupled to one of a power source or a ground; and a second bond wire bonded to the portion of the leadframe and to a control integrated circuit. The portion of the leadframe may form a current sense area and the control integrated circuit may be configured to use the second bond wire and the current sense area to measure a current flowing through the first bond wire during operation.

公开(公告)号：US20200312748A1

公开(公告)日：2020-10-01

申请号：US16504929

申请日：2019-07-08

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Hiroshi INOGUCHI ,  Isao OCHIAI ,  Takayuki TAGUCHI

IPC: H01L23/495 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31

Abstract: Leadframe systems and related methods. Specific implementations of leadframe systems may include a die pad, a semiconductor die coupled to the die pad, where the semiconductor die has a perimeter. A leadframe may be coupled over the die pad and the semiconductor die where the leadframe has a solder dam coupled around the semiconductor die and, the solder dam has a perimeter that corresponds with the semiconductor die The die pad may have no groove adjacent to the semiconductor die.