公开(公告)号：US20240427972A1

公开(公告)日：2024-12-26

申请号：US18648952

申请日：2024-04-29

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Klaus NEUMAIER ,  James Joseph VICTORY ,  Vaclav VALENTA ,  Sameer YADAV ,  Wai Lun CHU

IPC: G06F30/31 ,  G06F111/20

Abstract: Implementations of an object file for modeling using a three dimensional modeling module may include a first object defined as a root object, the first object corresponding with a first component of a semiconductor package; a second object corresponding with a second component of the semiconductor package directly physically coupled to the first component of the semiconductor package, the second object including a reference to the root object; and at least a third object corresponding with a third component of the semiconductor package, the third object including a reference to the root object, the third component of the semiconductor package directly coupled with a fourth component of the semiconductor package indirectly physically coupled to the second component of the semiconductor package.