公开(公告)号：US20240120355A1

公开(公告)日：2024-04-11

申请号：US18473659

申请日：2023-09-25

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Gregg BARDEL ,  Shih-Chang TAI ,  Shunsuke YASUDA ,  Weng-Jin WU

IPC: H01L27/146

CPC classification number: H01L27/14623 ,  H01L27/14685

Abstract: Implementations of a cover for an image sensor may include an optically transmissive portion and a black mask layer applied as a strip adjacent a perimeter of a largest planar surface of the optically transmissive portion. The first edge of the strip closest to the perimeter may be separated from the perimeter by a predetermined distance.