公开(公告)号：US20240120355A1

公开(公告)日：2024-04-11

申请号：US18473659

申请日：2023-09-25

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Gregg BARDEL ,  Shih-Chang TAI ,  Shunsuke YASUDA ,  Weng-Jin WU

IPC: H01L27/146

CPC classification number: H01L27/14623 ,  H01L27/14685

Abstract: Implementations of a cover for an image sensor may include an optically transmissive portion and a black mask layer applied as a strip adjacent a perimeter of a largest planar surface of the optically transmissive portion. The first edge of the strip closest to the perimeter may be separated from the perimeter by a predetermined distance.

公开(公告)号：US20250113626A1

公开(公告)日：2025-04-03

申请号：US18478296

申请日：2023-09-29

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Michael J. SEDDON ,  Gregg BARDEL

IPC: H01L27/146

Abstract: An electromagnetic irradiation system may include a bulb assembly and a light emitting diode panel. The bulb assembly and light emitting diode panel may be coupled over a package tray conveyor and the bulb assembly and the light emitting diode panel may be configured so that a package tray including a plurality of image sensor packages encounters irradiation from the light emitting diode panel prior to encountering irradiation from the bulb assembly.