公开(公告)号：US20200350271A1

公开(公告)日：2020-11-05

申请号：US16929335

申请日：2020-07-15

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Thomas Fairfax LONG ,  Jeffrey Peter GAMBINO ,  Charles Alvah HILL

IPC: H01L23/00 ,  H01L23/31

Abstract: Implementations of a semiconductor package may include: a first wafer having a first surface and a first set of blade interconnects, the first set of blade interconnects extending from the first surface. The package may include a second wafer having a first surface and a second set of blade interconnects, the second set of blade interconnects extending from the first surface and oriented substantially perpendicularly to a direction of orientation of the first set of blade interconnects. The first set of blade interconnects may be hybrid bonded to the second set of blade interconnects at a plurality of points of intersection between the first and second set of blade interconnects. The plurality of points of intersection may be located along a length of each blade interconnect of the first set of blade interconnects, and along the length of each blade interconnect of the second set of blade interconnects.

公开(公告)号：US20180096988A1

公开(公告)日：2018-04-05

申请号：US15285824

申请日：2016-10-05

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Thomas Fairfax LONG ,  Jeffrey Peter GAMBINO ,  Charles Alvah HILL

IPC: H01L27/06 ,  H01L23/00 ,  H01L23/31

Abstract: Implementations of a semiconductor package may include: a first wafer having a first surface and a first set of blade interconnects, the first set of blade interconnects extending from the first surface. The package may include a second wafer having a first surface and a second set of blade interconnects, the second set of blade interconnects extending from the first surface and oriented substantially perpendicularly to a direction of orientation of the first set of blade interconnects. The first set of blade interconnects may be hybrid bonded to the second set of blade interconnects at a plurality of points of intersection between the first and second set of blade interconnects. The plurality of points of intersection may be located along a length of each blade interconnect of the first set of blade interconnects, and along the length of each blade interconnect of the second set of blade interconnects.