公开(公告)号：US6361611B2

公开(公告)日：2002-03-26

申请号：US77857901

申请日：2001-02-07

Applicant: SEMITOOL INC

Inventor： JOLLEY MICHAEL K

IPC: C23C4/18 ,  C11D11/00 ,  C23G1/22 ,  G03F7/42 ,  H01L21/02 ,  H01L21/304 ,  H01L21/3213 ,  C03C23/00 ,  C23G1/02

CPC classification number: H01L21/02071 ,  C11D11/0047 ,  C23G1/22 ,  G03F7/425 ,  H01L21/32134

Abstract: A method for use in the manufacture of a microelectronic device is set forth. The method include to a first step in which a workpiece including exposed metallized surfaces and residues is provided. The workpiece, including the exposed metallized surfaces, is then treated with an alkaline, water-based solution containing one or more components that form an additive layer of an anti-corrosive compound on the exposed metallized surfaces. The solution reacts with the residues and assists in removing them from the workpiece. When the surfaces are principally include of aluminum, the solution may be include of DI water, an ammonium hydroxide based component, such as TMAH, silicic acid, and aluminum hydroxide.

Abstract translation: 阐述了一种用于制造微电子器件的方法。 该方法包括提供包括暴露的金属化表面和残留物的工件的第一步骤。 包括暴露的金属化表面的工件然后用含有一种或多种在露出的金属化表面上形成抗腐蚀化合物的添加剂层的一种或多种组分的碱性水基溶液处理。 溶液与残留物反应，有助于将其从工件中取出。 当表面主要包括铝时，溶液可以包括去离子水，氢氧化铵基组分如TMAH，硅酸和氢氧化铝。