公开(公告)号：US20230398643A1

公开(公告)日：2023-12-14

申请号：US18033750

申请日：2021-11-17

申请人： SENJU METAL INDUSTRY CO., LTD.

发明人： Yuki IIJIMA ,  Shunsaku YOSHIKAWA ,  Kanta DEI ,  Takahiro MATSUFUJI ,  Kota SUGISAWA

IPC分类号： B23K35/26 ,  B23K35/02 ,  C22C13/02

CPC分类号： B23K35/262 ,  B23K35/0244 ,  C22C13/02 ,  B23K2101/40

摘要： The present invention employs a lead-free and antimony-free solder alloy which has an alloy composition that contains from 1.0% by mass to 4.0% by mass of Ag, from 0.1% by mass to 1.0% by mass of Cu, from 0.1% by mass to 9.0% by mass of Bi, from 0.005% by mass to 0.3% by mass of Ni and from 0.001% by mass to 0.015% by mass of Ge, with the balance being made up of Sn.