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公开(公告)号：US20200306895A1
公开(公告)日：2020-10-01
申请号：US16830024
申请日：2020-03-25
发明人： Yuki IIJIMA , Hikaru NOMURA , Takashi SAITO , Naoko IZUMITA , Shunsaku YOSHIKAWA
摘要： A solder alloy has an alloy composition consisting of, in mass %, Ag: from 3.2 to 3.8%, Cu: from 0.6 to 0.8%, Ni: from 0.01 to 0.2%, Sb: from 2 to 5.5%, Bi: from 1.5 to 5.5%, Co: from 0.001 to 0.1%, Ge: from 0.001 to 0.1%, and optionally at least one of Mg, Ti, Cr, Mn, Fe, Ga, Zr, Nb, Pd, Pt, Au, La and Ce: 0.1% or less in total, with the balance being Sn. The alloy composition satisfies the following relationship (1): 2.93≤{(Ge/Sn)+(Bi/Ge)}×(Bi/Sn) (1). In the relationship (1), each of Sn, Ge, and Bi represents the content (mass %) in the alloy composition.
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公开(公告)号：US20190001443A1
公开(公告)日：2019-01-03
申请号：US16066956
申请日：2017-08-17
发明人： Takashi SAITO , Shunsaku YOSHIKAWA , Yoko KURASAWA
摘要： Provided are a solder alloy for preventing Fe erosion, a resin flux cored solder, a wire solder, a resin flux cored wire solder, a flux coated solder, a solder joint, and a soldering method which, in order to prolong the life of a soldering iron tip, suppress erosion of the soldering iron tip and by which adhesion of carbide to the soldering iron tip is suppressed. The present invention has an alloy composition comprising, by mass %, 0.02-0.1% Fe, more than 0% and equal to or less than 0.2% Zr, with the remainder being Sn, and is used to prevent Fe erosion.
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公开(公告)号：US20230398643A1
公开(公告)日：2023-12-14
申请号：US18033750
申请日：2021-11-17
CPC分类号： B23K35/262 , B23K35/0244 , C22C13/02 , B23K2101/40
摘要： The present invention employs a lead-free and antimony-free solder alloy which has an alloy composition that contains from 1.0% by mass to 4.0% by mass of Ag, from 0.1% by mass to 1.0% by mass of Cu, from 0.1% by mass to 9.0% by mass of Bi, from 0.005% by mass to 0.3% by mass of Ni and from 0.001% by mass to 0.015% by mass of Ge, with the balance being made up of Sn.
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4.发明申请公开(公告)号：US20220324062A1
公开(公告)日：2022-10-13
申请号：US17706965
申请日：2022-03-29
摘要： Provided is a preform solder including a first metal containing Sn and a second metal formed of an alloy containing Ni and Fe. Alternatively, provided is a preform solder (1) having a metal structure including a first phase (10) that is a continuous phase and a second phase (20) dispersed in the first phase (10), the first phase (10) contains Sn, the second phase (20) is formed of an alloy containing Ni and Fe, and a grain boundary (15) of a metal is present in the first phase (10).
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公开(公告)号：US20210114143A1
公开(公告)日：2021-04-22
申请号：US17042551
申请日：2019-03-22
发明人： Toru HAYASHIDA , Shunsaku YOSHIKAWA , Takashi SAITO , Kanta DEI
IPC分类号： B23K35/02 , B23K35/26 , B23K35/362
摘要： Provided is a solder paste which uses a conventional flux, and for which long-term preservation is made possible and an easy preservation method can be realized by suppressing changes in the viscosity of the paste over time. This solder paste is provided with a solder powder, a zirconium oxide powder, and a flux, and changes in the viscosity of the paste over time are suppressed.
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6.发明公开公开(公告)号：US20230201976A1
公开(公告)日：2023-06-29
申请号：US18117754
申请日：2023-03-06
CPC分类号： B23K35/262 , B23K35/0233 , B23K35/3033 , C22C13/00 , C22C19/03
摘要： Provided is a preform solder including a first metal containing Sn and a second metal formed of an alloy containing Ni and Fe. Alternatively, provided is a preform solder (1) having a metal structure including a first phase (10) that is a continuous phase and a second phase (20) dispersed in the first phase (10), the first phase (10) contains Sn, the second phase (20) is formed of an alloy containing Ni and Fe, and a grain boundary (15) of a metal is present in the first phase (10).
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公开(公告)号：US20220143761A1
公开(公告)日：2022-05-12
申请号：US17603500
申请日：2020-06-12
发明人： Shunsaku YOSHIKAWA , Takashi SAITO , Takahiro MATSUFUJI , Naoko IZUMITA , Yuuki IIJIMA , Kanta DEI
摘要： A solder alloy has an alloy composition consisting of, in mass%, Cu: 0.1% to 2.0%, Ni: 0.01% to 0.4%, P: 0.001% to 0.08%, and Ge: 0.001% to 0.08%, with the balance being Sn. The alloy composition satisfies the following relations (1) to (3): (Cu+5Ni)≤0.945% (relation (1)), (P+Ge)≤0.15% (relation (2)), 2.0≤(Cu+5Ni)/(P+Ge)≤1000 (relation (3)). In the above relations (1) to (3), Cu, Ni, P, and Ge each represents a content (mass %) thereof in the solder alloy.
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公开(公告)号：US20200376608A1
公开(公告)日：2020-12-03
申请号：US16642288
申请日：2019-02-22
摘要： The present invention provides a solder alloy, a solder paste, a solder ball, a resin flux-cored solder and a solder joint, both of which has the low-melting point to suppress the occurrence of the fusion failure, improves the ductility and the shear strength, and has excellent heat-cycle resistance. The solder alloy comprises an alloy composition composed of 35 to 68 mass % of Bi, 0.1 to 2.0 mass % of Sb, 0.01 to 0.10 mass % of Ni, and a balance of Sn. The alloy composition may contain at least one of Co, Ti, Al and Mn in total amount of 0.1 mass % or less. The solder alloy may be suitably used for a solder paste, a solder ball, a resin flux-cored solder and a solder joint.
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公开(公告)号：US20180001426A1
公开(公告)日：2018-01-04
申请号：US15613895
申请日：2017-06-05
发明人： Masayuki SUZUKI , Naoko IZUMITA , Shunsaku YOSHIKAWA , Ken TACHIBANA , Rei FUJIMAKI , Hikaru NOMURA
CPC分类号： B23K35/025 , B23K35/0222 , B23K35/0244 , B23K35/26 , B23K35/262 , B23K35/36 , C22C13/00 , C22C13/02 , H05K3/3463 , H05K2201/10636 , Y02P70/611 , Y10T403/479
摘要： Provided is a lead-free solder alloy that has excellent tensile strength and ductility, does not deform after heat cycles, and does not crack. The In and Bi content are optimized and the Sb and Ni content are adjusted. As a result, this solder alloy has an alloy composition including, by mass, 1.0 to 7.0% of In, 1.5 to 5.5% of Bi, 1.0 to 4.0% of Ag, 0.01 to 0.2% of Ni, and 0.01 to 0.15% of Sb, with the remainder made up by Sn.
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公开(公告)号：US20230226648A1
公开(公告)日：2023-07-20
申请号：US18126695
申请日：2023-03-27
发明人： Takashi SAITO , Shunsaku YOSHIKAWA , Naoko IZUMITA
CPC分类号： B23K35/262 , C22C13/00 , H05K1/0298 , H05K3/3457 , B23K2101/42
摘要： A method for step-soldering includes applying a first solder alloy having a melting point in a temperature range from 160 to 210° C. to a jointed portion of a first electronic component and a substrate, and heating them in the temperature range from 160 to 210° C., and applying a second solder alloy having the melting point in a temperature range lower than 160° C. to a joint portion of a second electronic component and the substrate, and heating them in the temperature range lower than 160° C. The first solder alloy consists of 13-22 mass % of In, 0.5-2.8 mass % of Ag, 0.5-5.0 mass % of Bi, 0.002-0.05 mass % of Ni and a balance Sn.
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