公开(公告)号：US20150195640A1

公开(公告)日：2015-07-09

申请号：US14590421

申请日：2015-01-06

Applicant: SENNHEISER COMMUNICATIONS A/S

Inventor： Mohamad ESSABAR ,  Peter Vestergaard VÆRUM ,  Bo SKJOLDBORG ,  Christian ERN

IPC: H04R1/10

CPC classification number: H04R1/1058 ,  H04R1/1033 ,  H04R1/105 ,  H04R5/0335

Abstract: A headphone with over the head passage and two earphone housings is provided, with one housing attached at each end of the over the head passage at attachment areas thereof, and an electrical lead element passing between the over the head passage and the earphone housing. The over the head passage is connected at the attachment area to an earphone housing at an earphone attachment site arranged externally of the earphone housing, and the earphone housing comprise a lead element opening spaced from the earphone attachment site. The lead element opening is larger than the electrical lead element and the lead element is slidably arranged in the lead element opening.

Abstract translation: 提供了一种在头部通道和两个耳机壳体之上的耳机，其一个壳体在其头部通道的附接区域的两端附接，并且电引线元件在头部通道和耳机壳体之间通过。 头部通道上方的连接区域连接到位于耳机外壳外部的耳机附件位置处的耳机外壳，耳机外壳包括与耳机附件位置间隔开的引线元件开口。 引线元件开口大于电引线元件，并且引线元件可滑动地布置在引线元件开口中。