公开(公告)号：US20230228619A1

公开(公告)日：2023-07-20

申请号：US18067066

申请日：2022-12-16

Applicant: SENSORTEK TECHNOLOGY CORP.

Inventor： YU-MIN LIN ,  FENG-JUNG HSU

IPC: G01J1/02 ,  G01J1/04

CPC classification number: G01J1/0271 ,  G01J1/0459 ,  G01J1/0474 ,  G01J2001/0276

Abstract: An optical sensor module and a packaging method thereof are disclosed, wherein the optical sensor module comprises a substrate having a light sensing element; and a housing made of a transparent material. The housing is connected to the substrate and covers the light sensing element. The housing has a light-receiving area facing the light sensing element, and the inner surface of the housing toward the substrate is provided with a light-shielding coating in a portion outside of the light-receiving area. In this way, optical components such as the light sensor can be effectively protected, and still retain the effect of avoiding noise light interference with the light sensor module.