Light emitting device and manufacturing method thereof

    公开(公告)号:US12176458B2

    公开(公告)日:2024-12-24

    申请号:US18200356

    申请日:2023-05-22

    Abstract: A light emitting device includes a substrate; a pattern of a plurality of protrusions protruding from the substrate; a first semiconductor layer provided on the substrate; an active layer provided on the first semiconductor layer; and a second semiconductor layer provided on the active layer, in which each of the protrusions includes a first layer formed integrally with the substrate and protruding from an upper surface of the base substrate; and a second layer provided on the first layer and formed of a material different from that of the first layer.

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