公开(公告)号：US20040020427A1

公开(公告)日：2004-02-05

申请号：US10632962

申请日：2003-08-04

Applicant: SEZ AG

Inventor： Kurt Langen

IPC: B05C013/00

CPC classification number: H01L21/68735 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/6708 ,  Y10S134/902

Abstract: A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, near the edge, in which the liquid is applied to a first surface, flows essentially radially to the outside to the peripheral-side edge of the wafer-shaped article and around this edge onto the second surface, the liquid wetting a defined section near the edge on the second surface and thereupon being removed from the wafer-shaped article.

Abstract translation: 将液体施加到第一表面的边缘附近的晶片状物品，特别是晶片的限定区域液体处理的装置基本上沿径向流动到外部的外围边缘 晶片状制品，并且在该边缘周围的第二表面上，液体润湿在第二表面上的边缘附近的限定部分，随后从晶片状制品上移除。