公开(公告)号：US12104054B2

公开(公告)日：2024-10-01

申请号：US17437555

申请日：2019-04-08

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Liexiang He ,  Yongnian Qi ,  Xianping Zeng ,  Zhongqiang Yang ,  Hualin Pan

IPC: C08L63/04 ,  C08J5/24 ,  C08K3/013 ,  C08K5/00

CPC classification number: C08L63/04 ,  C08J5/244 ,  C08J5/249 ,  C08K3/013 ,  C08K5/0066 ,  C08J2363/04 ,  C08L2201/02 ,  C08L2203/20

Abstract: The present disclosure discloses a resin composition, and a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 100 parts by weight of a halogen-free epoxy resin, 11-37 parts by weight of an active ester resin, and 40-66 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group. The prepreg, laminate and printed circuit board prepared from such resin composition have a low dielectric loss factor, good flame retardancy, and also have high interlaminar adhesion and a low CTE.