VACUUM ION SPUTTERING TARGET DEVICE
    1.
    发明申请
    VACUUM ION SPUTTERING TARGET DEVICE 审中-公开
    真空离子喷射目标装置

    公开(公告)号:US20160155618A1

    公开(公告)日:2016-06-02

    申请号:US14416150

    申请日:2014-12-08

    Inventor: Tao Zhou

    Abstract: A vacuum ion sputtering target device is disclosed, which has an accommodating space provided with a substrate, a magnetron, a target, and a back plate disposed therein. The target is disposed above the back plate, the magnetron is provided below the back plate, the substrate is disposed above the target; wherein a shape of the target depends on a distribution of a magnetic field strength. Target utilization is quiet high, and there is basically no target remaining, so costs will be reduced.

    Abstract translation: 公开了一种真空离子溅射靶装置,其具有设置有基板,磁控管,靶和背板的容纳空间。 靶设置在背板的上方,磁控管设置在背板的下方,基板设置在目标上方; 其中所述目标的形状取决于磁场强度的分布。 目标利用率居高不下,基本没有目标,所以成本会降低。

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