公开(公告)号：US20230244163A1

公开(公告)日：2023-08-03

申请号：US18068230

申请日：2022-12-19

Applicant: SHIBAURA ELECTRONICS CO., LTD.

Inventor： Hiroki Miyazaki ,  Morihisa Hamada ,  Yuki Ishii ,  Yuri Okada ,  Ryota Murakoshi

IPC: G03G15/20 ,  G01K1/16 ,  G01K7/18

CPC classification number: G03G15/205 ,  G01K1/16 ,  G01K7/18

Abstract: There are provided a temperature sensor that has following capability to a temperature measurement object and has excellent responsiveness, and a temperature detection device and an image forming apparatus each including the temperature sensor. A temperature sensor used in contact with a temperature measurement object, includes: a thermosensitive element configured to detect a temperature of the temperature measurement object; a heat collection member including an abutting portion configured to abut on the temperature measurement object, and configured to be thermally joined with the thermosensitive element; and a holding member including a housing portion configured to house the heat collection member. The heat collection member is swingably held by the holding member, to maintain a state where the abutting portion abuts on the temperature measurement object.

公开(公告)号：US11860559B2

公开(公告)日：2024-01-02

申请号：US18068230

申请日：2022-12-19

Applicant: SHIBAURA ELECTRONICS CO., LTD.

Inventor： Hiroki Miyazaki ,  Morihisa Hamada ,  Yuki Ishii ,  Yuri Okada ,  Ryota Murakoshi

IPC: G03G15/20 ,  G01K7/18 ,  G01K1/16

CPC classification number: G03G15/205 ,  G01K1/16 ,  G01K7/18

Abstract: There are provided a temperature sensor that has following capability to a temperature measurement object and has excellent responsiveness, and a temperature detection device and an image forming apparatus each including the temperature sensor. A temperature sensor used in contact with a temperature measurement object, includes: a thermosensitive element configured to detect a temperature of the temperature measurement object; a heat collection member including an abutting portion configured to abut on the temperature measurement object, and configured to be thermally joined with the thermosensitive element; and a holding member including a housing portion configured to house the heat collection member. The heat collection member is swingably held by the holding member, to maintain a state where the abutting portion abuts on the temperature measurement object.