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公开(公告)号：US11906246B2
公开(公告)日：2024-02-20
申请号：US16899767
申请日：2020-06-12
发明人： Yukinobu Nishibe , Akinori Iso , Keigo Oomori , Takashi Takahashi
摘要： According to one embodiment, an organic film forming apparatus includes a chamber configured to maintain an atmosphere more reduced than an atmospheric pressure, at least one processing room provided inside the chamber and being surrounded by a cover, and an exhaust part configured to exhaust the inside the chamber. The processing room includes an upper heating part including first heaters, a lower heating part including second heaters, and facing the upper heating part, an upper heat equalizing plate provided on the lower heating part side of the upper heating part, a lower heat equalizing plate provided on the upper heating part side of the lower heating part, and workpiece supporters configured to support a workpiece through a gap between the upper and lower heat equalizing plates.
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公开(公告)号：US20200310183A1
公开(公告)日：2020-10-01
申请号：US16899767
申请日：2020-06-12
发明人： Yukinobu Nishibe , Akinori Iso , Keigo Oomori , Takashi Takahashi
IPC分类号： G02F1/1337 , F26B3/30 , F26B9/06 , F27D7/06
摘要： According to one embodiment, an organic film forming apparatus includes a chamber configured to maintain an atmosphere more reduced than an atmospheric pressure, at least one processing room provided inside the chamber and being surrounded by a cover, and an exhaust part configured to exhaust the inside the chamber. The processing room includes an upper heating part including first heaters, a lower heating part including second heaters, and facing the upper heating part, an upper heat equalizing plate provided on the lower heating part side of the upper heating part, a lower heat equalizing plate provided on the upper heating part side of the lower heating part, and workpiece supporters configured to support a workpiece through a gap between the upper and lower heat equalizing plates.
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