公开(公告)号：US20220248502A1

公开(公告)日：2022-08-04

申请号：US17582298

申请日：2022-01-24

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Yuichi IMAOKA ,  Yosuke MOCHIZUKI ,  Kyota KUROIWA ,  Akinori ISO

IPC: H05B3/22

Abstract: According to an embodiment of the present disclosure, a heat treatment device includes: a chamber capable of maintaining an atmosphere that is decompressed from an atmospheric pressure; an exhaust unit capable of exhausting an inside of the chamber through an exhaust port provided in the chamber; a support portion provided inside the chamber and capable of supporting a workpiece; a first heating unit provided inside the chamber and capable of heating the workpiece; an adhesion preventive plate detachably provided on an inner wall of the chamber; and a second heating unit capable of heating the adhesion preventive plate.