公开(公告)号：US20240260187A1

公开(公告)日：2024-08-01

申请号：US18423833

申请日：2024-01-26

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Hiroshi YOKOTA

IPC分类号： H05K1/11 ,  H05K3/06 ,  H05K3/24

CPC分类号： H05K1/113 ,  H05K3/062 ,  H05K3/067 ,  H05K3/244 ,  H05K2201/0338 ,  H05K2201/0347 ,  H05K2201/099

摘要： A wiring board includes an insulating layer, first and second pads provided on the insulating layer and including a first surface in contact with the insulating layer, a second surface opposite to the first surface, and a side surface connecting the first and second surfaces, respectively, and a protective insulating layer provided above the insulating layer. The first and second pads have a portion exposed inside an opening in the protective insulating layer. The first pad has a portion opposing the second pad without the protective insulating layer interposed between the first and second pads. A region of the second surface of the first and second pads exposed from the protective insulating layer is covered with a plating layer. A region of the side surface of the first and second pads exposed from the protective insulating layer is exposed from the plating layer.