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公开(公告)号：US20240284593A1
公开(公告)日：2024-08-22
申请号：US18629124
申请日：2024-04-08
发明人： Hikaru Tanaka , Takashi Kasuga
IPC分类号： H05K1/11 , H01L21/48 , H01L23/498 , H05K3/38
CPC分类号： H05K1/113 , H01L21/4857 , H01L23/49822 , H05K3/381
摘要： A wiring substrate includes: a wiring layer; an insulating layer that is laminated on the wiring layer; an opening portion that passes through the insulating layer to the wiring layer; and an electric conductor film that is formed at the opening portion of the insulating layer. A surface of the insulating layer includes a smoothed portion that is not covered by the electric conductor film, and a roughened portion that includes an inner wall surface of the opening portion covered by the electric conductor film and that have surface roughness that is greater than surface roughness of the smoothed portion.
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公开(公告)号：US20220278045A1
公开(公告)日：2022-09-01
申请号：US17674231
申请日：2022-02-17
发明人： Takashi Kasuga , Takashi Sato , Yasuyuki Yamaguchi
IPC分类号： H01L23/538 , H01L23/532 , H01L21/48 , H01L21/768
摘要： A built-in component board includes a first insulating layer; wiring layer and a metal pad layer that are formed on the first insulating layer; a second insulating layer that is formed on the wiring layer and the metal pad layer; and a cavity that is formed on the second insulating layer and that exposes the metal pad layer. Furthermore, the built-in component board includes an electronic component that is mounted on the metal pad layer; and a filling layer that is filled in the cavity and that buries the electronic component. Furthermore, a metal used for the metal pad layer includes a metal having thermal conductivity that is lower than that of a metal used for the wiring layer.
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公开(公告)号：US11997787B2
公开(公告)日：2024-05-28
申请号：US17573152
申请日：2022-01-11
发明人： Hikaru Tanaka , Takashi Kasuga
IPC分类号： H05K1/11 , H01L21/48 , H01L23/498 , H05K3/38
CPC分类号： H05K1/113 , H01L21/4857 , H01L23/49822 , H05K3/381
摘要： A wiring substrate includes: a wiring layer; an insulating layer that is laminated on the wiring layer; an opening portion that passes through the insulating layer to the wiring layer; and an electric conductor film that is formed at the opening portion of the insulating layer. A surface of the insulating layer includes a smoothed portion that is not covered by the electric conductor film, and a roughened portion that includes an inner wall surface of the opening portion covered by the electric conductor film and that have surface roughness that is greater than surface roughness of the smoothed portion.
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公开(公告)号：US20230089948A1
公开(公告)日：2023-03-23
申请号：US17947489
申请日：2022-09-19
发明人： Takashi Kasuga , Tomoyuki Shimodaira , Hikaru Tanaka , Naotaka Noguchi , Takashi Sato , Hitoshi Kondo
IPC分类号： H05K1/11
摘要： A wiring board includes: a wiring layer; an insulating layer laminated on the wiring layer; an opening portion penetrating through the insulating layer to the wiring layer; a recess portion formed in a surface of the wiring layer exposed from the opening portion of the insulating layer; and a conductor film formed in the opening portion of the insulating layer and the recess portion of the wiring layer, wherein the recess portion of the wiring layer includes a raised portion, which is raised higher than an outer peripheral portion of a bottom surface, at a central portion of the bottom surface.
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公开(公告)号：US20220225503A1
公开(公告)日：2022-07-14
申请号：US17573152
申请日：2022-01-11
发明人： Hikaru Tanaka , Takashi Kasuga
IPC分类号： H05K1/11 , H01L21/48 , H05K3/38 , H01L23/498
摘要： A wiring substrate includes: a wiring layer; an insulating layer that is laminated on the wiring layer; an opening portion that passes through the insulating layer to the wiring layer; and an electric conductor film that is formed at the opening portion of the insulating layer. A surface of the insulating layer includes a smoothed portion that is not covered by the electric conductor film, and a roughened portion that includes an inner wall surface of the opening portion covered by the electric conductor film and that have surface roughness that is greater than surface roughness of the smoothed portion.
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