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公开(公告)号:US10062855B2
公开(公告)日:2018-08-28
申请号:US14740006
申请日:2015-06-15
Applicant: LG CHEM, LTD.
Inventor: Hyun Jee Yoo , Yoon Gyung Cho , Suk Ky Chang , Jung Sup Shim , Suk Chin Lee , Kwang Jin Jeong
IPC: H01L33/00 , H01L29/08 , H01L51/00 , H01L21/00 , H01L51/52 , H05B33/04 , H01L51/56 , C09J7/00 , C09J163/00 , H01L21/56 , H01L23/28 , H01L23/29 , H01L23/00 , C09J9/00 , C09J11/04 , C09J7/35 , C09J7/10 , C08K3/22 , C08K3/34 , C08K3/36 , C08K3/16
CPC classification number: H01L51/0094 , C08K3/16 , C08K3/22 , C08K3/346 , C08K3/36 , C08K2003/162 , C08K2003/166 , C08K2003/2206 , C09J7/00 , C09J7/10 , C09J7/35 , C09J9/00 , C09J11/04 , C09J163/00 , C09J2201/134 , C09J2201/36 , C09J2201/61 , C09J2203/326 , C09J2205/102 , C09J2463/00 , H01L21/56 , H01L23/28 , H01L23/295 , H01L23/564 , H01L51/0034 , H01L51/0035 , H01L51/5246 , H01L51/5253 , H01L51/5256 , H01L51/5259 , H01L51/56 , H01L2251/301 , H01L2251/303 , H01L2924/0002 , H05B33/04 , H01L2924/00
Abstract: An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.
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公开(公告)号:US20180230343A1
公开(公告)日:2018-08-16
申请号:US15891648
申请日:2018-02-08
Applicant: FUJIMORI KOGYO CO., LTD.
Inventor: Toshiyuki TAKEDA , Nagako TAKAHASHI
IPC: C09J123/12 , C09J163/04 , C09J11/06 , B32B37/10 , B32B37/15 , B32B15/08 , B32B27/18 , B32B27/32 , B32B27/38 , B32B7/12
CPC classification number: C09J123/12 , B32B7/12 , B32B15/08 , B32B27/18 , B32B27/32 , B32B27/38 , B32B37/02 , B32B37/10 , B32B37/153 , B32B2309/02 , B32B2323/10 , B32B2363/00 , B32B2367/00 , B32B2377/00 , B32B2405/00 , C09J7/10 , C09J11/06 , C09J123/14 , C09J151/06 , C09J163/04 , C09J2201/36 , C09J2201/61 , C09J2400/20 , C09J2423/10 , C09J2451/00 , C09J2453/003 , C09J2463/00 , C08L51/06 , C08L63/04
Abstract: Provided are an adhesive resin laminate having an excellent adhesive force to two adherends, a laminate in which this adhesive resin laminate is laminated with two adherends, and a method of producing them. An adhesive resin laminate having at least a first adhesive layer and a second adhesive layer, in which the first adhesive layer includes a base resin and a crosslinking agent, the base resin is a modified polyolefin resin, the crosslinking agent is an epoxy-based compound, the second adhesive layer includes a polyolefin-based resin, and when an adhesion initiation temperature of the first adhesive layer is set to T1, and an adhesion initiation temperature of the second adhesive layer is set to T2, T2 is higher than T1 by 30° C. or more.
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公开(公告)号:US20180171182A1
公开(公告)日:2018-06-21
申请号:US15128334
申请日:2015-04-02
Applicant: LINTEC CORPORATION
Inventor: Kazue UEMURA , Takamasa KASE , Yumiko AMINO , Kiichiro KATO , Shigeru SAITO
IPC: C09J7/38 , C09J121/00 , C09J133/08 , C09J167/00 , C09J175/04
CPC classification number: C09J7/383 , B05D1/36 , B05D3/108 , B05D5/00 , C08K3/013 , C08K3/34 , C08K3/346 , C08K3/36 , C08K7/00 , C08K2201/003 , C09J5/00 , C09J7/10 , C09J7/20 , C09J7/203 , C09J7/22 , C09J7/255 , C09J7/38 , C09J7/385 , C09J11/04 , C09J121/00 , C09J133/08 , C09J167/00 , C09J175/04 , C09J201/00 , C09J2201/16 , C09J2201/28 , C09J2201/36 , C09J2201/606 , C09J2205/10 , C09J2205/102 , C09J2205/114 , C09J2400/163 , C09J2421/00 , C09J2433/00 , C09J2467/006 , C09J2475/00 , C09J2483/005 , C08K3/00
Abstract: A pressure sensitive adhesive sheet is provided, containing a substrate or a release material having thereon a resin layer including a resin part (X) containing as a main component a hydrocarbon resin having a carbon atom on a main chain of a structural unit, and a particle part (Y) consisting of fine particles containing silica particles, and at least a surface (α) of the resin layer being opposite to the side of the substrate or being opposite to the side which the release material is provided, having pressure sensitive adhesiveness, the resin layer containing a multilayer structure having a layer (Xα) and a layer (Y1) in this order in the thickness direction from the side of the surface (α), in a measurement of an intensity ratio (Si/C) of a peak intensity (Si) derived from a silicon atom and a peak intensity (C) derived from a carbon atom with an energy dispersive X-ray analyzer in the thickness direction from the side of the surface (α) of the resin layer, the intensity ratio in the layer (Xα) being less than 0.10, and the intensity ratio in the layer (Y1) being 0.10 or more, the surface (α) having concave portions of irregular shapes.
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公开(公告)号:US20180154624A1
公开(公告)日:2018-06-07
申请号:US15800254
申请日:2017-11-01
Applicant: TYCO ELECTRONICS CORPORATION
Inventor: Inho MYONG
CPC classification number: B32B37/1207 , B29C61/0616 , B29C63/0017 , B29C63/42 , B29C65/4815 , B29C65/68 , B29K2105/0032 , B29K2105/0097 , B29K2995/0049 , C08K5/0041 , C09D5/26 , C09J7/10 , C09J7/30 , C09J2201/36 , C09J2201/606 , C09J2201/61 , C09J2205/102 , F16L47/22 , H02G15/1806 , Y02P70/26
Abstract: A process of heat recovering tubing includes forming a multilayer tubing assembly, heating the multilayer tubing assembly to a shrink temperature to form a heat-recovered tubing assembly, and visually inspecting the heat-recovered tubing assembly for a presence of at least one colorant. A multilayer tubing assembly and an adhesive assembly are also disclosed. The multilayer tubing assembly includes an outer tubing of a heat-recoverable material, an inner tubing of a heat-meltable material, a substrate encased by the inner tubing, at least one protrusion encased by the inner tubing, and an adhesive strip including an adhesive composition and the colorant. The outer tubing encases the inner tubing. The adhesive strip is located between the substrate and the protrusion.
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公开(公告)号:US09960139B2
公开(公告)日:2018-05-01
申请号:US14428582
申请日:2013-09-17
Applicant: DEXERIALS CORPORATION
Inventor: Kouichi Sato , Yasushi Akutsu
IPC: H01L23/00 , B29C71/04 , G02F1/1345 , B23B3/30 , C09J9/02 , B29C59/02 , B32B33/00 , C09J7/00 , B32B3/30 , B32B7/12 , B32B27/08 , B32B27/20 , B32B27/30 , B32B27/36 , B32B27/38 , B32B3/08 , C08K3/08 , B29K63/00 , B29L9/00 , B29L31/34 , B29C35/08
CPC classification number: H01L24/28 , B29C59/02 , B29C71/04 , B29C2035/0827 , B29C2059/028 , B29K2063/00 , B29L2009/003 , B29L2031/34 , B32B3/08 , B32B3/30 , B32B7/12 , B32B27/08 , B32B27/20 , B32B27/308 , B32B27/36 , B32B27/38 , B32B33/00 , B32B2255/205 , B32B2264/102 , B32B2264/104 , B32B2270/00 , B32B2307/202 , B32B2307/412 , B32B2307/706 , B32B2457/00 , B32B2457/202 , C08K3/08 , C08K2201/001 , C09J7/00 , C09J7/10 , C09J9/02 , C09J2201/36 , C09J2201/602 , C09J2203/326 , C09J2205/102 , G02F1/13452 , G02F1/13454 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/13144 , H01L2224/16227 , H01L2224/27003 , H01L2224/271 , H01L2224/2711 , H01L2224/2712 , H01L2224/27334 , H01L2224/29076 , H01L2224/2908 , H01L2224/29083 , H01L2224/2919 , H01L2224/29195 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29371 , H01L2224/29387 , H01L2224/29388 , H01L2224/2939 , H01L2224/29391 , H01L2224/29393 , H01L2224/29394 , H01L2224/29395 , H01L2224/294 , H01L2224/29486 , H01L2224/29494 , H01L2224/29499 , H01L2224/32225 , H01L2224/73204 , H01L2224/75301 , H01L2224/81488 , H01L2224/81903 , H01L2224/83192 , H01L2224/83203 , H01L2224/83488 , H01L2224/83851 , H01L2224/83856 , H01L2224/83862 , H01L2224/83871 , H01L2224/83874 , H01L2224/83885 , H01L2224/83907 , H01L2924/01006 , H01L2924/01049 , H01L2924/0105 , H01L2924/0543 , H01L2924/0544 , H01L2924/0549 , H01L2924/07802 , H01L2924/07811 , H01L2924/351 , H01L2924/3511 , H01L2924/381 , Y10T156/1039 , Y10T428/24562 , H01L2924/00012 , H01L2924/0665 , H01L2924/0635 , H01L2924/069 , H01L2924/07025 , H01L2924/066 , H01L2924/06 , H01L2924/00014 , H01L2924/0615
Abstract: To reduce substrate warp occurring after connection an anisotropic conductive film is used. An anisotropic conductive film has: a first insulating adhesive layer; a second insulating adhesive layer; and a conductive particle-containing layer sandwiched by the first insulating adhesive layer and the second insulating adhesive layer and having conductive particles contained in an insulating adhesive, wherein air bubbles are contained between the conductive particle-containing layer and the first insulating adhesive layer, and, the conductive particle-containing layer, a portion thereof below the conductive particles and in contact with the second insulating adhesive layer has a lower degree of cure than other portions thereof.
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公开(公告)号:US20180112109A1
公开(公告)日:2018-04-26
申请号:US15783507
申请日:2017-10-13
Applicant: TESA SE
Inventor: Marcel HÄHNEL , Jennifer KIPKE , Christoph NAGEL , Jannik SELLIN
IPC: C09J7/02
CPC classification number: C09J7/255 , C08K7/14 , C08K9/00 , C09J7/38 , C09J2201/36 , C09J2400/14 , C09J2467/006 , D06M10/025 , H01F17/04
Abstract: Method for producing an adhesive tape including the steps of providing an adhesive layer to at least one side of a liner or a carrier film and treating at least one filament and/or the adhesive layer with a plasma, and introducing the at least one filament into the adhesive layer.
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公开(公告)号:US20180079937A1
公开(公告)日:2018-03-22
申请号:US15561764
申请日:2016-03-29
Applicant: TESA SE
Inventor: Anna BLAZEJEWSKI , Axel BURMEISTER , Franciska LOHMANN , Anika PETERSEN
IPC: C09J153/02 , C09J7/02
CPC classification number: C09J153/02 , C08K7/22 , C09J7/10 , C09J7/22 , C09J7/38 , C09J2201/128 , C09J2201/36 , C09J2201/606 , C09J2201/618 , C09J2203/318 , C09J2203/322 , C09J2203/33 , C09J2205/102 , C09J2205/11 , C09J2409/00 , C09J2425/00 , C09J2453/00
Abstract: The invention relates to a contact-adhesive tape which can be removed damage-free and residue-free by stretching the tape substantially within the adhesion plane and which consists of one or more adhesive substance layers, all made of a contact-adhesive substance expanded with micro-balloons, and one or two optional intermediate backings. The disclosed contact-adhesive tape consists exclusively of the aforementioned adhesive substance layers and optional intermediate backings, and the one external upper surface as well as the one external lower surface of the contact-adhesive tape are formed by said adhesive substance layer or layers.
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公开(公告)号:US09856403B2
公开(公告)日:2018-01-02
申请号:US14088237
申请日:2013-11-22
Applicant: LG CHEM, LTD.
Inventor: Jong Rok Jeon , Se Woo Yang , Joon Hyung Kim , Yong Sung Goo , Suk Ky Chang
IPC: C09J7/00 , C09J7/02 , C09J133/08 , C09J4/00
CPC classification number: C09J7/0207 , C09J4/00 , C09J7/00 , C09J7/10 , C09J7/24 , C09J7/38 , C09J133/08 , C09J2201/134 , C09J2201/36 , C09J2201/606 , C09J2201/622 , C09J2433/00 , C09J2475/006 , Y10T428/24942
Abstract: The present application relates to a method of preparing a pressure-sensitive adhesive product and the pressure-sensitive adhesive product. According to the present application, the pressure-sensitive adhesive product having different physical properties on both surfaces, for example, having different peeling strengths on both surfaces, or having a structure in which a pressure-sensitive adhesive and a support are sequentially formed may be efficiently provided.
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公开(公告)号:US20170327714A1
公开(公告)日:2017-11-16
申请号:US15528929
申请日:2016-11-04
Applicant: LG Chem, Ltd.
Inventor: Kwang Su Seo , Eun Kyung Park , Seung Won Lee , Jang Soon Kim , Won Gu Choi , Tae Yi Choi
IPC: C09J7/02 , C09J123/22 , C09J201/08 , B32B27/30 , C09J133/06 , C09J11/06
CPC classification number: C09J7/20 , B32B27/308 , C08L23/30 , C08L2312/00 , C09J4/00 , C09J7/35 , C09J11/06 , C09J123/22 , C09J123/30 , C09J133/066 , C09J201/08 , C09J2201/36 , C09J2203/318 , C09J2409/00 , Y10T428/2852 , C08F220/18
Abstract: The present invention relates to an adhesive composition for optical use, which is applied to optical devices or display devices and thus may exhibit excellent adhesion performance while exhibiting a high barrier performance based on a low water vapor transmission rate, and may implement both excellent optical characteristics and durability, and specifically, provides an adhesive composition for optical use, the adhesive composition including: a thermally curable rubber including an isobutylene-isoprene rubber having a carboxyl group and an isobutylene-isoprene rubber having a hydroxy group; and a thermal crosslinking agent. Further, the present invention provides an adhesive film for optical use, including an adhesive layer including photocured products of the adhesive composition for optical use.
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公开(公告)号:US09765241B2
公开(公告)日:2017-09-19
申请号:US14771012
申请日:2014-03-03
Applicant: Rohm and Haas Company
Inventor: William B. Griffith, Jr. , Melissa Lane
IPC: B32B7/12 , C09J7/02 , C09J133/08
CPC classification number: C09J7/0246 , C09J7/385 , C09J133/08 , C09J2201/134 , C09J2201/36 , C09J2201/622 , C09J2433/00
Abstract: Provided is a pressure sensitive adhesive article comprising (a) a substrate (Sa), (b) in contact with said substrate (Sa), a layer (Lb) of a composition (Cb) that comprises one or more acrylic polymer (POLb) having Tg of −10° C. or lower, and (c) in contact with said layer (Lb), a layer (Lc) of a composition (Cc) that comprises one or more acrylic polymer (POLc) that comprises 20% to 90% polymerized units of one or more high-aliphatic vinyl monomer, by weight based on the weight of said polymer (POLc). Also provided is a bonded article made by a process of contacting a substrate (Sd) with such a pressure sensitive adhesive article, wherein said substrate (Sd) is in contact with said layer (Lc).
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