公开(公告)号：US20200031973A1

公开(公告)日：2020-01-30

申请号：US16494511

申请日：2018-04-04

Applicant: SHOWA DENKO K.K.

Inventor： Aoi HASEGAWA ,  Masatoshi MORI

IPC: C08F222/40

Abstract: A curable resin composition, which has excellent flowability and reactivity at the time of molding, with which a highly reliable cured product which has excellent heat resistance can be obtained by curing is provided. A curable resin composition comprising a polyalkenyl phenol compound (A) and a polymaleimide compound (B), wherein the polyalkenyl phenol compound (A) is a compound containing at least two structural units represented by the following formula (1): where R1 and R2 each independently represent a hydrogen atom, a C1-10 alkyl group, a C1-2 alkoxy group, or a hydroxy group, Q represents a C5-10 cycloalkylene group or a divalent organic group containing an alicyclic fused ring, and Y is an alkenyl group.