公开(公告)号：US20200031973A1

公开(公告)日：2020-01-30

申请号：US16494511

申请日：2018-04-04

Applicant: SHOWA DENKO K.K.

Inventor： Aoi HASEGAWA ,  Masatoshi MORI

IPC: C08F222/40

Abstract: A curable resin composition, which has excellent flowability and reactivity at the time of molding, with which a highly reliable cured product which has excellent heat resistance can be obtained by curing is provided. A curable resin composition comprising a polyalkenyl phenol compound (A) and a polymaleimide compound (B), wherein the polyalkenyl phenol compound (A) is a compound containing at least two structural units represented by the following formula (1): where R1 and R2 each independently represent a hydrogen atom, a C1-10 alkyl group, a C1-2 alkoxy group, or a hydroxy group, Q represents a C5-10 cycloalkylene group or a divalent organic group containing an alicyclic fused ring, and Y is an alkenyl group.

公开(公告)号：US20190225566A1

公开(公告)日：2019-07-25

申请号：US16330470

申请日：2017-08-09

Applicant: SHOWA DENKO K.K.

Inventor： Aoi HASEGAWA ,  Yoshitaka ISHIBASHI

IPC: C07C39/06 ,  C07C37/14 ,  C07C39/16 ,  C07C39/225 ,  C08L65/02

Abstract: Provided is a method with which it is possible to produce a polyalkenylphenol compound having a narrow molecular weight distribution and low viscosity at high purity and high yield. A poly 2-alkenyl aromatic ether compound having two or more phenol skeletons is subjected to Claisen rearrangement in the presence of a phenol or naphthol compound.

公开(公告)号：US20210284783A1

公开(公告)日：2021-09-16

申请号：US16319675

申请日：2017-05-25

Applicant: SHOWA DENKO K.K.

Inventor： Aoi HASEGAWA ,  Chika YAMASHITA ,  Yoshitaka ISHIBASHI ,  Tomonori TAJIMA ,  Hiromi OTAKE

IPC: C08G8/30 ,  C08K5/3415

Abstract: Provided are a curable resin mixture and a curable resin composition which contain a polyalkenylphenol resin and an aromatic polymaleimide compound having high crystallinity and a high melting point, and which exhibit excellent fluidity and reactivity. Also provided is a method for producing a curable resin mixture that contains: (A) a polyalkenylphenol resin which contains a polyalkenylphenol compound having at least 2 phenol skeletons in the molecule, a prescribed 2-alkenyl group being bonded to some or all of aromatic rings that form the phenol skeletons in the molecule; and (B) an aromatic polymaleimide compound. The method comprises: heating the aromatic polymaleimide compound (B) to the melting point or above and thereby melting the compound; and mixing the molten aromatic polymaleimide compound (B) and the polyalkenylphenol resin (A) within a temperature range at which the aromatic polymaleimide compound (B) does not recrystallize.

公开(公告)号：US20200031966A1

公开(公告)日：2020-01-30

申请号：US16603375

申请日：2018-04-04

Applicant: SHOWA DENKO K.K.

Inventor： Aoi HASEGAWA ,  Yoshitaka ISHIBASHI

IPC: C08F212/34 ,  C08F222/40 ,  C08L61/06

Abstract: A curable resin composition provides a cured resin product having excellent heat resistance and flame retardancy by curing. The curable resin composition includes a polyalkenyl phenol compound (A) and a polymaleimide compound (B), wherein the polyalkenyl phenol compound (A) is a compound containing at least two structural units represented by the following formula (1a): where R1 to R7 each independently represent a hydrogen atom, a C1-10 alkyl group, a C1-2 alkoxy group, a C2-6 alkenyl group, or a hydroxy group, Y1 is an alkenyl group.