CURABLE COMPOSITION, TRANSPARENT HEAT-RESISTANT MATERIAL, AND USE THEREOF
    1.
    发明申请
    CURABLE COMPOSITION, TRANSPARENT HEAT-RESISTANT MATERIAL, AND USE THEREOF 有权
    可固化组合物,透明耐热材料及其用途

    公开(公告)号:US20160017076A1

    公开(公告)日:2016-01-21

    申请号:US14771010

    申请日:2014-02-27

    CPC classification number: C08F222/1006 C08F216/125 C08F2222/104 C09D4/00

    Abstract: The present invention provides a curable composition, which contains a crosslinking aid (B) containing three or more allyl groups in the molecule in an amount of 1 to 50 parts by mass, polyfunctional (meth)acrylic compound (C) in an amount of 5 to 50 parts by mass, and photopolymerization initiator (D1) and/or thermal polymerization initiator (D2) in an amount of 0.1 to 10 parts by mass, respectively, as a polymerization initiator (D) to 100 parts by mass of allyl group-terminated allyl ester oligomer (A);wherein the crosslinking aid (B) containing allyl group is a compound containing three or more allyl groups in a molecule; wherein the content of impurities derived from the crosslinking aid (B) in the curable composition is less than 0.1 mass %; wherein the content of the (meth)acrylic compound containing a hydroxyl group in a molecule (C1) in the curable composition is 0.5 to 30 mass %.

    Abstract translation: 本发明提供一种固化性组合物,其含有1〜50质量份的分子中含有3个以上的烯丙基的交联助剂(B),多官能(甲基)丙烯酸系化合物(C)的含量为5 相对于聚合引发剂(D)为0.1〜10质量份的光聚合引发剂(D1)和/或热聚合引发剂(D2),相对于100质量份的烯丙基 - 封端的烯丙基酯低聚物(A); 其中含有烯丙基的交联助剂(B)是分子中含有3个以上烯丙基的化合物; 其中,来自所述交联助剂(B)的固化性组合物中的杂质含量小于0.1质量% 其中,所述固化性组合物中的分子(C1)中含有羟基的(甲基)丙烯酸类化合物的含量为0.5〜30质量%。

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